ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,002, issued on April 7, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Substrate-integrated waveguide" was invented by Yiqi Tang (Allen,... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,003, issued on April 7, was assigned to AaltoSemi Inc. (Nanjing City, China). "Manufacturing method of package substrate" was invented by A... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,004, issued on April 7, was assigned to NXP USA INC. (Austin, Texas). "Semiconductor device with active mold package and method therefor" w... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,005, issued on April 7, was assigned to ZF Friedrichshafen AG (Friedrichshafen, Germany). "Power electronics module" was invented by Ake Ew... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,006, issued on April 7, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Electronic device" was invented by Yuji Ishimatsu (Kyoto, Japan), Ke... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,007, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Composite IC die package including an electro-thermo-mechanical... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,008, issued on April 7, was assigned to NXP USA INC. (Austin, Texas). "Transistor with source manifold in non-active die region" was invent... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,009, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure" was invented by ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,010, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic packages with embedded interposers" was invente... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,011, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and met... Read More